HYPERSONIC proposes a multilevel materials engineering approach covering a wide value chain from materials formulation to device fabrication and evaluation, including (1) printing networks of various types of nanosheets with minimum inter-nanosheet resistance (by either chemical formation of covalent bonds to cross-link the nanosheets or by geometrical control of the nanosheets’ shape having a specific length/thickness ratio), (2) characterising the electrical and electronic properties of films, (3) demonstration of proof-of-concept p- or n-type conduction (thus CMOS compatible) high-performance thin-film transistors (TFT) devices, and (4) demonstrating medium-scale integration of circuits by incorporating them in functional sensors. However, devices based on networks of nanosheets usually exhibit (a) structural defects and inhomogeneities in thickness, (b) variability in fabrication processes, and (c) environmental sensitivity due to substrate effects and ambient conditions, leading therefore to significant device-to-device variability and reliability issues. The enhanced statistical analysis through large-scale data collection and statistical modelling of multiple devices is still missing from HYPERSONIC. This approach, combined with machine learning (ML) tools for pattern recognition, could therefore constitute a key step towards performance prediction, reliability forecasting, and fabrication process optimisation through closed feedback loops. The participation of the widening partner HMU through this Hop-on Facility constitutes a complementary addition to the consortium, enabling the optimisation of 2D-based electronic devices. HYPERSONIC’s success will further enhance Europe’s research and leadership in printed electronics for both consumer and commercial applications, addressing the needs of emerging technologies such as the Internet of Things (IoT) and wearables, especially where rigid silicon technology is not applicable, aiming at improving our well-being.